Spherical Silicon Dioxide for EMC Epoxy Molding Compound

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Supplier Info.

Company Name Taizhou Sunflex Industrial Co.,Ltd.
Membership Free member
Registration Date2006.09.08
Country/RegionChina
CityTaizhou
Contact Mark Xu(Mr.)

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Product Attributes

- Place of Origin China
- Supply Type OEM Service
- Condition New
- Color White
- CAS No. 7631869
- Purity 99.3
- Related Keywords spherical silica beads, Epoxy Molding Compound, spherical silicon powder

Description by Manufacturer

In electronic packaging, it is required that the integrated circuit has high moisture resistance, low stress, low alpha radiation, resistance to immersion and reflow soldering, and good performance in the plastic packaging process after packaging. In response to these requirements, epoxy sealant must be doped with inorganic fillers in the resin matrix. The currently used inorganic fillers are mostly silicon micro powders, which have the functions of reducing the thermal expansion coefficient of the sealant, increasing thermal conductivity, reducing dielectric constant, environmental protection, flame retardancy, reducing internal stress, preventing moisture absorption, increasing the strength of the sealant, and reducing the cost of the sealant.

The advantages of using spherical silicon micro powder for EMC Epoxy Molding Compound are:

1. The surface fluidity of the ball is good and the resin is stirred evenly to form a film. The amount of resin added is small, and the filling amount of powder can reach the highest, with a mass ratio of up to 90.5%. Therefore, spheroidization means an increase in the filling rate of silicon micro powder. The higher the filling rate of silicon micro powder, the smaller its thermal expansion coefficient and the lower its thermal conductivity, which is closer to the thermal expansion coefficient of single crystal silicon. As a result, the performance of electronic components produced from this is also better.

2. The stress concentration of the plastic encapsulation material formed by spheroidization is the smallest, and the strength is the highest. When the stress concentration of the plastic encapsulation material for angular powder is 1, the stress of the spherical powder is only 0.6. Therefore, when encapsulating integrated circuit chips with spherical powder plastic encapsulation material, the yield is high, and it is not easy to cause mechanical damage during transportation, installation, and use.

3. Spherical powder has a lower friction coefficient and less wear on molds compared to angular powder. Compared to angular powder, the service life of molds can be doubled. The price of plastic packaging molds is very high, and some even need to be imported. This is also important for packaging factories to reduce costs and improve economic efficiency.

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Spherical Silicon Dioxide for EMC Epoxy Molding Compound

Company Profile

About Taizhou Sunflex Industrial Co.,Ltd.

Membership Free member
Registration Date2006.09.08
Country/RegionChina
CityTaizhou
Contact Mark Xu(Mr.)

Taizhou Sunflex Industrial Co., Ltd. is the largest enterprise specially engaged in the production of 3M similar all weather reflective glass beads,high refractive glass beads and black enamel for car glass. As a high-tech enterprise in Zhejiang province and a unit providing technology innovation fund for national-level small and medium technology-based firms, it is responsible for state torch programs in Taizhou. In December 2002, it passed the ISO 9001 Quality System Certification.
The enterprise boasts a city-level technology center and a high-tech research and development center for special glass, staffed with a group of professional talents devoting to new products research and development. Long-term cooperation has been established with four famous experts from the Shanghai Institute of Ceramics, Chinese Academy of Sciences (one of them enjoys the specialist allowance from State Council) and more than 10 experts having senior professional titles or above from other scientific research institutes are invited for collaboration. With the strong technical power and research capability, it is capable of research and development of special glass used in optics and electronics fields. The technology center mainly focuses on the research and development of high refractive index glass beads and low melting-point glass powder. By making use of the technical advantage, it is devoted to new products development, knockout products cultivation and scale expansion.
The company has been combining the production with research and development and established long and stable cooperation with Shanghai Institute of Ceramics, Chinese Academy of Sciences for technical support.
The products are mainly all weather reflective glass beads,high refractive index glass beads, low melting-point glass powder,glass powder for solar cell paste,lead- free glass black glaze and flexible copper clad laminate for automobiles.
Contact email:tzsunflex(at)gmail(dot)com

Selling Categories

- Chemicals >> Adhesives & Sealants
- Chemicals >> Pigment
- Chemicals >> Other Inorganic Chemicals
- Energy >> Solar Energy Products

Keywords

glass beads , high refractive , glass powder , low-melting , lead- free , black glaze

Registration Date	2006/09/08(Year/Month/Date)
Buyer / Seller in EC21	Seller
Business Type	Manufacturer
Year established	1994
Employees total	51 - 100
Annual revenue	USD 10,000,001 - 50,000,000

Contact Information Order Credit Report

Company	Taizhou Sunflex Industrial Co.,Ltd.
Address	jiaojiang district,taizhou,zhejiang,chinaTaizhouZhejiang318000China
Phone	0086 - 13456 - 666272
Fax	0086 - 576 - 8853382
Contact	Mark Xu / sales manager

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