There are 244 thermal pad from 116 suppliers on EC21.com
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AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive industry, high-precision machinery, green energy industry, aerospace industry and other military fields.
Registration Date | 2025/06/30(Year/Month/Date) |
---|---|
Buyer / Seller in EC21 | Seller |
Business Type | Manufacturer |
Year established | 2020 |
Employees total | 11 - 50 |
Annual revenue | USD 2,000,001 - 5,000,000 |