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SERVICES:electronic material procurement, PCB production, PCBA assembly, cable assembly, finished product assembly, functional testing. PRODUCTION LINES: 5 SMT high-speed production lines, 2 DIP...
Application Power supply equipment CHIP Size 0402 QFN Spacing 0.4mm QFN Spacing 0.4mm Package Type Tape package, Tay tray package, Pipe package
PCBA Application Power supply equipment CHIP Size 0402 QFN Spacing 0.4mm QFN Spacing 0.4mm Package Type Tape package, Tay tray package, Pipe package
Hanken is One-Stop TurnKey EMS Solution Provider that turn your brilliant idea to a real product. We can supply to you PCB Fabrication, Components Sourcing, PCB Assembly( 6 SMT lines*2 DIP lines ),...
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can...