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Suppliers > customization > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
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" found 38 companies from Henan Hanyin Optoelectronics Technology Co., Ltd, China
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(1-20 out of 38)

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material Electronic Packing Material

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material Electronic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC
due to external stress or internal thermal stress. Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material Electronic Packing Material

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material Electronic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components
structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and can be thinned, and can be used in ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials
Aluminum Silicon Carbide AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...
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