There are 399 Alumina Ceramic from 164 suppliers on EC21.com
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AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
Specification
Silicon Carbide | volume fraction 65 % |
Density(g/cm³) | 3.01 |
Elastic Modulus(GPa) | 215±5 |
Bending Strength(MPa) | 380 |
Tensile Strength (MPa) | 270 |
Coefficient of Thermal Expansion(10-6/K) | 7.5±1 |
Thermal Conductivity(W/m·K) | 210±10 |
Product Features
-Adjustable coefficient of thermal expansion (CTE)
-Excellent thermal conductivity and heat dissipation performance
-Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance
-Excellent wear resistance -Surface Machinability and Metalization
Application Fields
-Semiconductor packaging
-Automotive industry
-EADS
-Optical system Precision Instrument
-Racing engine pushrods
-AlSiC box structure parts
-Robot engine putters
-Helicopter accessories
Registration Date | 2025/06/30(Year/Month/Date) |
---|---|
Buyer / Seller in EC21 | Seller |
Business Type | Manufacturer |
Year established | 2020 |
Employees total | 11 - 50 |
Annual revenue | USD 2,000,001 - 5,000,000 |