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Min. Order:
30 Piece
Price:
US$ 68
Place of origin:
China
Supply Ability:
100000Pieces/per Month
silicon carbide. The main processes include powder metallurgy, infiltration method, etc. Aluminum Silicon Carbide Electronic Substrate Specification Silicon Carbide volume fraction 65 % Density (g/cm³) 3.01 Elastic Modulus (GPa) 215±5 Bending Strength (MPa) 380 Tensile Strength (MPa) 270 Coefficient of Thermal Expansion (10-6/K) 7.5±1 Thermal Conductivity (W/m·K) 210±
[Related Keywords : electronic packaging, heat sinks, Al-SiC, Ceramic Substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Place of origin:
Taiwan
Al2O3-3x3 for 5~6W (pnl:116.6x57.15mm for 36pcs) Size:12x12xt0.5mm with 0.7~0.8mm silicon cavity Chips size: 24mil~35mil LED COB ceramic substrate Al2O3--3x3 for 9 die and 5~6Wt used Al2O3--5x5 for 25 die and 20 Wt used AlN--7x7 for 49 die and 50Wt used AlN 10x10 for 100 die and 100Wt used Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit plati
[Related Keywords : LED package, LED substrate, ceramic cob, ceramic pcb]
Business Type
Manufacturer
Location
Hsinchu County, Taiwan
Employees Total
51 - 100
Annual Revenue
USD 100,000 - 500,000
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