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Products > epoxy > Qingdao Docbond New Material Co.,Ltd | Similar Products

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DOCBOND|High Thermal Conductivity Epoxy Adhesive: This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, ...

DOCBOND|Two-component Structural Adhesive: This series of products have high structural bonding strength. In the shear strength test in the laboratory, the bonding property of this product is stronger than that of steel strip. The product is ...

DOCBOND|Conductive Adhesive: This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|Underfill DB840B: DB840B The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by ...

DOCBOND|Low Temperature Curing Adhesive: DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|Water Adhesive for Fuel Cell Bipolar Plate: The application of this series of product in hydrogen fuel electric reactor is：double plate water bonding The product is a single component，high temperature resistance，activated epoxy resin，on a ...

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DOCBOND|High Thermal Conductivity Epoxy Adhesive