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This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip

| Registration Date | 2023/02/02(Year/Month/Date) |
|---|---|
| Buyer / Seller in EC21 | Seller |
| Business Type | Manufacturer |
| Year established | 2020 |
| Employees total | 101 - 500 |
| Annual revenue | USD 100,000 - 500,000 |
| Company | Qingdao Docbond New Material Co.,Ltd |
|---|---|
| Address | No. 628, Jiushui East Road, Laoshan DistrictQingdaoShandong266100China |
| Phone | 86 - 0532 - 81700039 |
| Homepage | www.Qingdaodocbondchina.com |
| Contact | CHONGLE LIANG |