EC21, Global B2B Marketplace
Sign In
Join Free
Buy Now
Sell Now
My EC21
Help
Search Advanced Search
Products > Performance Machine > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
Your search for "

Performance Machine

" found 32 Products from Henan Hanyin Optoelectronics Technology Co., Ltd, China
Inquire Now

(1-20 out of 32)

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
performance Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC
due to external stress or internal thermal stress. Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
of Thermal Expansion（10-6/K） 7.5±1 Thermal Conductivity（W/m·K） 210±10 Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
performance -High rigidity and high strength Excellent thermal shock resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials

Thermal Conductive Material,Metal Matrix Composite,Al/SIC,Metal Matrix Composite Ceramic Materials
performance -Low density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide
Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate
95-220 Bending Strength（MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials
the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material
ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...
Page 1 of 212Next  
Go to Page Go
Share :
Facebook
Twitter
LinkedIn
My Favorites
Email this page

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838

Inquiry Basket ()