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Products > household appliances > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
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" found 10 Products from Henan Hanyin Optoelectronics Technology Co., Ltd, China
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Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
Devices -Thermal Management Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
Management Aluminum Silicon Carbide Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate
Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate
Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic Substrate
electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material

AlSIC,Aluminum Ceramic Al-SiC,Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material
component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable energy -Smart grid -Traffic control -Power ...

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC

Aluminum Silicon Carbide Pipe,Thermal Conductive Material,Lightweight Materials,AlSiC,Al/SiC,Al-SiC
component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Smart grid -Traffic control -Power conversion -Industrial ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Aluminum Silicon Carbide ...
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