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Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate: AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, and the overall weight loss of the radar is 10 kg, ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate: Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Aluminum Silicon Carbide IGBT Base Plate: Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Aluminum Based Silicon Carbide Electronic Substrate: Aluminum Based Silicon Carbide Electronic Substrate Description AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is ...

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Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate