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Products > plating machines > Henan Hanyin Optoelectronics Technology Co., Ltd | Similar Products
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" found 10 Products from Henan Hanyin Optoelectronics Technology Co., Ltd, China
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(1-10 out of 10)

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC

Electronic Packaging Materials,Heat Sinks,Semiconductor Packaging & Assembly Materials,Al-SiC,AlSiC
Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC

Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC
Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC

Heat Sinks,Electronic Packaging Materials,Semiconductor Packaging & Assembly Materials,Al-SiC,Al/SiC
Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
Plate is very light, only has a 1/3 weight of the copper, but its bending strength is as good as the steel. This makes it excellent in seismic performance, exceeding the copper substrate. Therefore, ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...
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