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Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate: Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide: Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials: the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Aluminum Silicon Carbide IGBT Base Plate: Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components: AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material: ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Aluminum Based Silicon Carbide Electronic Substrate: electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

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Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate