In electronic packaging, it is required
that the integrated circuit has high moisture resistance, low stress, low alpha
radiation, resistance to immersion and reflow soldering, and good performance
in the plastic packaging process after packaging. In response to these
requirements, epoxy sealant must be doped with inorganic fillers in the resin
matrix. The currently used inorganic fillers are mos
[Related Keywords : spherical silica beads, Epoxy Molding Compound, spherical silicon powder, silica beads for EMC]