Min. Order:
20 Piece
Price:
US$ 200
Place of origin:
China
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc.,
[Related Keywords : Adhesive, DOCBOND, Epoxy Adhesive]