Min. Order:
Negotiation
Place of origin:
Korea
Price Condition:
FOB
Supply Ability:
Buyers request
Standard Systems provide semiconductor packaging services to assemble die in wafer form to various package types :BGA,QFP,SO,QFN,PLCC, SOIC, PDIP, Etc...... Willing to work for Fabless and IC Design companies can meet your budget and size objectives with our services.
Small quantity including Prototype of packages will be solved by our assitance.
If have a question, Please contact me.
Best Regard
[Related Keywords : Microelectronics, Microcomponents, IC Package Assembly, Multi-chip package]