EC21, Global B2B Marketplace
Sign In
Join Free
Buy Now
Sell Now
My EC21
Help
Search Advanced Search
Suppliers > copper component > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
Your search for "

copper component

" found 10 companies from Henan Hanyin Optoelectronics Technology Co., Ltd, China
Inquire Now

(1-10 out of 10)

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC

Aluminum Heatsink,Aluminum Base,Aluminum Ceramic Substrate,Electronic Substrat,Thermal Pad,Al-SiC
density and high specific rigidity -High rigidity and high strength -Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Aluminum Silicon Carbide ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate
Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide
Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate
copper substrate. Aluminum Silicon Carbide IGBT Base Plate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic Substrate
copper, but its bending strength is as good as the steel. This makes it excellent in seismic performance, exceeding the copper substrate. Therefore, in high-power electronic packaging, Aluminum ...
Page 1 of 11
Go to Page Go
Share :
Facebook
Twitter
LinkedIn
My Favorites
Email this page

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838

Inquiry Basket ()