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Suppliers > engine > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
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(1-20 out of 31)

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Aluminum Silicon Carbide Structural Parts FAQs Q1: What are the primary applications of Al-SiC Structural ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Aluminum Silicon Carbide Structural Parts FAQs Q1: What are the primary applications of Al-SiC Structural ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
Devices -Thermal Management Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
Management Aluminum Silicon Carbide Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Aluminum Silicon Carbide Structural Parts FAQs Q1: What are the primary applications of Al-SiC Structural ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
of Thermal Expansion（10-6/K） 7.5±1 Thermal Conductivity（W/m·K） 210±10 Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Aluminum Silicon Carbide Structural Parts FAQs Q1: What are the primary applications of Al-SiC Structural ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
Machinability and Metalization Applications -Electronic component thermal management -High-precision machinery -Aerospace industry -Household appliances -Transportation -Power engineering -Renewable ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate
Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Aluminum Silicon Carbide IGBT Base Plate

Aluminum Silicon Carbide IGBT Base Plate
Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Aluminum Based Silicon Carbide Electronic Substrate

Aluminum Based Silicon Carbide Electronic Substrate
electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC
Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high ...
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