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Suppliers > fields > Henan Hanyin Optoelectronics Technology Co., Ltd | Matching Products
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(1-20 out of 28)

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter ...

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC

Thermal Pad Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.1mm Al/SiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
of Thermal Expansion（10-6/K） 7.5±1 Thermal Conductivity（W/m·K） 210±10 Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter ...

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide

Ceramic Substrate,Ceramic Materia,Thermal Pad,Electronic Substrat,Aluminum Silicon Carbide
Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate

Ceramic Substrate,Ceramic Material,Ceramic Metallize,AlSiC,AlSiC Plate,Ceramic Plate
95-220 Bending Strength（MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials
the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components

Thermal Pad 0.2mm AlSiC with High Thermal Conductivity for Heat Sinks and Electronic Components
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material
ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product ...

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC

Precision Instrument Materials ,Aerospace Materials ,Optoelectronic Materials,Al/SiC,Al-SIC
thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC

Metal Matrix Composite Ceramic Materials ,Semiconductor Material,Alumina Ceramic,AlSiC,Al-SiC,Al/SiC
Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high ...
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