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High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC: Machinability and MetalizationApplications -High-Power Electronic Devices -Thermal Management Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,: of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment: high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC: high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate: of thermal expansion (CTE) -Excellent thermal conductivity and heat dissipation performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock ...

Electronic Substrate,AlSiC IGBT Base Plate,Ceramic Substrate,Heat Sinks,Al-SiC IGBT Base Plate: Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal ...

Aluminum Silicon Carbide IGBT Base Plate: Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K) 210±10 Aluminum Silicon Carbide IGBT Base Plate ...

Aluminum Based Silicon Carbide Electronic Substrate: electronic packaging, Aluminum Silicon Carbide IGBT Base Plates are irreplaceable materials due to their unique combination of high thermal conductivity, low thermal expansion coefficient, and ...

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