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Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material
Strength（MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal Expansion（10-6/K） 7.5±1 Thermal Conductivity（W/m·K） 210±10 Advantages -Matching the coefficient of thermal expansion can help ...

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC

High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC
strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Specification Silicon Carbide volume fraction Customized Density（g/cm³） ...

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC

Communication Components,Precision Structural Components,Silicon Carbide Structural Parts,AlSiC
strength and wear-resistant machinery components. Q2: What are the key properties of Al-SiC Structural Parts? Lightweight: Maintains a low density with high mechanical strength. High Wear Resistance: ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
strength and wear-resistant machinery components. Q2: What are the key properties of Al-SiC Structural Parts? Lightweight: Maintains a low density with high mechanical strength. High Wear Resistance: ...

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC

Semiconductor Packaging & Assembly Materials,Heat Sinks,Electronic Packaging Materials,Al-SiC,AlSiC
Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K） 210±10 Product Features -Adjustable coefficient of thermal expansion ...

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials

Semiconductor Packaging Materials, Heat Sink,Assembly Materials, Electronic Packaging Materials
Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K） 210±10 Product Features -Adjustable coefficient of thermal expansion ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material Electronic Packing Material

Silicon Aluminum Alloy, AlSi Alloy ,Al/Si Alloy IGBT Packing Material Electronic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC

Silicon Carbide Reinforced Aluminum,Aluminum Metal Matrix Composites,Lightweight Materials,AlSiC
Aluminum Silicon Carbide（AlSiC), a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional ...

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC

Metal Matrix Composite Ceramic Materials ,Thermal Conductive Material,Al/SIC,Aluminum Ceramic Al-SiC
Strength （MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion （10-6/K） 7-17 Thermal Conductivity （W/m·K） Customized Features -Adjustable coefficient of thermal ...

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material

Al-SiC Structural Parts,Components and Parts,Communication Cavity Material,Aluminum Ceramic Material
strength and wear-resistant machinery components. Q2: What are the key properties of Al-SiC Structural Parts? Lightweight: Maintains a low density with high mechanical strength. High Wear Resistance: ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC
strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal stress. Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent ...

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC

AlSiC Metal Matrix Composite,Precision Component Materials,Semiconductor Component Materials,Al/SiC
Strength（MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal ...

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material Electronic Packing Material

High-Silicon Aluminum Alloy AlSi Alloy Al/Si Alloy IGBT Packing Material Electronic Packing Material
AlSi combines aluminum metal and silicon together through powder metallurgy technology. It is lighter than aluminum , has the same rigidity as cast iron, and has low thermal expansion near to ...

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC

Thermal Conductive Material,Alumina Ceramic,Thermal Pad,Customized Ceramic Substrate,Al-SiC
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
strength is as good as the steel. This makes it excellent in seismic performance, exceeding the copper substrate. Therefore, in high-power electronic packaging, Aluminum Silicon Carbide IGBT Base ...

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC

Silicon Carbide Structural Parts,Precision Structural Components,Robot Components,AlSiC
strength and wear-resistant machinery components. Q2: What are the key properties of Al-SiC Structural Parts? Lightweight: Maintains a low density with high mechanical strength. High Wear Resistance: ...

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material

Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate ...
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