Min. Order:
20 Piece
Price:
US$ 36.8
Place of origin:
China
Supply Ability:
10000Pieces per Month
packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Henan Hanyin Optoelectronics specializes in new aluminum-based powder metallurgy materials and applications development.welcome you customized the products you need .Meet your demand and provide better goods and service is our g
[Related Keywords : Aluminum based materials, Semiconductor ceramics, Ceramic Substrate, Lightweight materials]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
10 Piece
Price:
US$ 98
Place of origin:
China
Supply Ability:
20000pieces per Month
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories
[Related Keywords : Aluminum based materials, Aluminum Composite Materi, Thermal conductive, Lightweight materials]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
30 Kilogram
Price:
US$ 32.8
Place of origin:
China
Supply Ability:
10000Pieces per Month
packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Henan Hanyin Optoelectronics specializes in new aluminum-based powder metallurgy materials and applications development.welcome you customized the products you need .Meet your demand and provide better goods and service is our g
[Related Keywords : Semiconductor ceramics, electronic packaging, Ceramic Substrate, Lightweight materials]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
16 Piece
Price:
US$ 36
Place of origin:
China
Supply Ability:
10000Pieces per Month
packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Henan Hanyin Optoelectronics specializes in new aluminum-based powder metallurgy materials and applications development.welcome you customized the products you need .Meet your demand and provide better goods and service is our g
[Related Keywords : Semiconductor ceramics, Aluminum based materials, Ceramic Substrate, Lightweight materials]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 18.8
Place of origin:
China
Supply Ability:
10000Pieces per Month
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost. AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. Aluminum Silicon Carbid
[Related Keywords : Aluminum Ceramic, Ceramic Materia, ceramic substrate, Electronic Packaging]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
50 Piece
Price:
US$ 21.8
Place of origin:
China
Supply Ability:
100000Pieces per Month
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost. AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and c
[Related Keywords : thermal pad, Electronic Substrat, Ceramic Materia, Electronic Packaging]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
18 Piece
Price:
US$ 28
Place of origin:
China
Supply Ability:
10000Pieces per Month
packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories Henan Hanyin Optoelectronics specializes in new aluminum-based powder metallurgy materials and applications development.welcome you customized the products you need .Meet your demand and provide better goods and service is our g
[Related Keywords : Semiconductor ceramics, electronic packaging, Ceramic Substrate, Lightweight materials]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
30 Kilogram
Price:
US$ 188
Place of origin:
China
Supply Ability:
20000kilograms/per Month
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories
[Related Keywords : Metal Matrix Composite, alumina ceramic, electronic packaging, Ceramic Substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
50 Piece
Price:
US$ 22.8
Place of origin:
China
Supply Ability:
100000Pieces/per Month
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost. AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and c
[Related Keywords : thermal pad, Electronic Packaging, Electronic Substrat, Ceramic Materia]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
50 Piece
Price:
US$ 26
Place of origin:
China
Supply Ability:
10000Pieces/per Month
performance -Low density and high specific rigidity -High rigidity and high strength Excellent thermal shock resistance -Excellent wear resistance -Surface Machinability and Metalization Application Fields -Semiconductor packaging -Automotive industry -EADS -Optical system Precision Instrument -Racing engine pushrods -AlSiC box structure parts -Robot engine putters -Helicopter accessories
[Related Keywords : Alumina Ceramic, Electronic Substrate, packaging substrate, High thermal conductivity]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 32.8
Place of origin:
China
Supply Ability:
10000Pieces/per Month
packaged, so that the chip can be used in vibration, high temperature and dust. The Aluminum Silicon Carbide IGBT Base Plate is very light, only has a 1/3 weight of the copper, but its bending strength is as good as the steel. This makes it excellent in seismic performance, exceeding the copper substrate. Therefore, in high-power electronic packaging, Aluminum Silicon Carbide IGBT Base Plates ar
[Related Keywords : Electronic Substrate, Electronic Packaging, AlSiC, Ceramic Substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 27
Place of origin:
China
Supply Ability:
10000Pieces/per Month
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost. AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. Specification Silicon C
[Related Keywords : Metal Matrix Composite, electronic packaging, Aluminum silicon, Ceramic Substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
10 Kilogram
Price:
US$ 118
Place of origin:
China
Supply Ability:
20000kilograms/per Month
Aluminum Silicon Carbide AlSiC, a ceramic matrix composite made of aluminum and SiC particles, features uniformly distributed aluminum stably bonded within the SiC structure. Compared to traditional Metal Matrix Composites, AlSiC offers superior structural stability and optimized material properties. Aluminum Silicon Carbide Substrate Specification Silicon Carbide volume fraction Customized Densi
[Related Keywords : Metal Matrix Composite, Al/SiC AlSiC Al-SiC, Ceramic Substrate, Metal Matrix Al-SiC]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 36
Place of origin:
China
Supply Ability:
10000Pieces/per Month
packaged, so that the chip can be used in vibration, high temperature and dust. The Aluminum Silicon Carbide IGBT Base Plate is very light, only has a 1/3 weight of the copper, but its bending strength is as good as the steel. This makes it excellent in seismic performance, exceeding the copper substrate. Therefore, in high-power electronic packaging, Aluminum Silicon Carbide IGBT Base Plates ar
[Related Keywords : Electronic Substrate, composite materials, IGBT Base Plate, electronic packaging]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 38.8
Place of origin:
China
Supply Ability:
100000Pieces/per Month
Substrate Specification Silicon Carbide volume fraction Customized Density（g/cm³） 2.82-3.02 Elastic Modulus（GPa） 95-220 Bending Strength（MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductiv
[Related Keywords : ceramic substrate, Ceramic Materia, Aluminum Ceramic, thermal pad]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 28
Place of origin:
China
Supply Ability:
100000Pieces/per Month
Substrate Specification Silicon Carbide volume fraction Customized Density（g/cm³） 2.82-3.02 Elastic Modulus（GPa） 95-220 Bending Strength（MPa） Customized Tensile Strength （MPa） Customized Coefficient of Thermal Expansion（10-6/K） 7-17 Thermal Conductivity（W/m·K） Customized Product Features -Adjustable coefficient of thermal expansion (CTE) -Excellent thermal conductivity
[Related Keywords : ceramic substrate, Ceramic Material, Aluminum Ceramic, Ceramic Plate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
30 Piece
Price:
US$ 68
Place of origin:
China
Supply Ability:
100000Pieces/per Month
Substrate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal Expansion （10-6/K） 7.5±1 Thermal Conductivity （W/m·K） 210±10 Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability an
[Related Keywords : electronic packaging, heat sinks, Al-SiC, Ceramic Substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
30 Piece
Price:
US$ 38.8
Place of origin:
China
Supply Ability:
10000Pieces/per Month
Aluminum Silicon Carbide IGBT Base Plate Description High-current IGBT (Insulated Gate Bipolar Transistor) modules generate a large amount of heat during operation. The AlSiC material is usually used to fabricate the IGBT substrate, and the high-power IGBT module is firmly packaged, so that the chip can be used in vibration, high temperature and dust. The Aluminum Silicon Carbide IGBT Base Plate
[Related Keywords : IGBT Base Plate, Aluminum Silicon Carbide, thermal conductive materi, hermetic packaging]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
50 Piece
Price:
US$ 21.8
Place of origin:
China
Supply Ability:
100000Pieces/per Month
AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost. AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation. It is lightweight and c
[Related Keywords : thermal pad, aluminum silicon carbide, Electronic Packaging, Electronic Substrat]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Min. Order:
20 Piece
Price:
US$ 58
Place of origin:
China
Supply Ability:
100000Pieces/per Month
Substrate Specification Silicon Carbide volume fraction 65 % Density（g/cm³） 3.01 Elastic Modulus（GPa） 215±5 Bending Strength（MPa） 380 Tensile Strength （MPa） 270 Coefficient of Thermal Expansion（10-6/K） 7.5±1 Thermal Conductivity（W/m·K） 210±10 Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability
[Related Keywords : aluminum silicon carbide, ceramic material, heat sink, ceramic substrate]
Business Type
Manufacturer
Location
Henan, China
Employees Total
11 - 50
Annual Revenue
USD 2,000,001 - 5,000,000
Competitive packaging substrate products from various packaging substrate manufacturers and packaging substrate suppliers are listed above, please select quality and cheap items for you.
 |
Recommended Content
