AlSiC featured a lightweight design with superior heat dissipation. With a density one-third of copper, AlSiC is ideal for heat dissipation baseplates. Integrating the heat sink and base plate reduces thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stable heat transfer and dissipation.
Aluminum Silicon Carbide Substrate Specification
| Silicon Carbide |
volume fraction Customized |
| Density（g/cm³） |
2.82-3.02 |
| Elastic Modulus（GPa） |
95-220 |
| Bending Strength（MPa） |
Customized |
| Tensile Strength （MPa） |
Customized |
| Coefficient of Thermal Expansion（10-6/K） |
7-17 |
| Thermal Conductivity（W/m·K） |
Customized |
Product Features
-Adjustable coefficient of thermal expansion (CTE)
-Excellent thermal conductivity and heat dissipation performance
-Low density and high specific rigidity
-High rigidity and high strength Excellent thermal shock resistance
-Excellent wear resistance
-Surface Machinability and Metalization
It is lightweight and can be thinned, and can be used in electronic component thermal management, automotive industry, high-precision machinery, green energy industry, aerospace industry and other military fields.
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