Advanced Automatic Bga Rework Station DH-A6

Ⅰ. Function/Features:

1. There are authority for supervisor and operator whose names can be changed/written/stored in, and the serial number of the repaired PCB and the used heat profile can be stored as many as required.

2. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;

3. Automatic disassembly, automatic welding, automatic recycle of chips, completely liberating workers;

4. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is more efficient, and the rework of the large chip is better;

5. Laser positioning, place the motherboard in one step;

6. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant temperature, environmental protection and energy saving, and prevent small components/dust from dropping;

7. External temperature measurement interfaces, convenient for temperature detection at any time, temperature control is more accurate and reliable;

8. Touch screen operation, preset program, which can be used proficiently without professional technical training, making chip repair very easy;

9. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;

10. An external USB interface is used for software updates and various repair data to be imported into the computer for analysis and storage;

11. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm.

11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)

Ⅱ. Product parameter

Power Supply: AC220V±10％ 50/60Hz

Rated Power: 6800W

Top heater: 1200W

Bottom heater: 1200W

IR preheating area: 4200W (Germany heating tube, heating area of 500*350mm)

Operation mod:

                         Fully automatically disassemble,suction,mounting and soldering Basic configuration                                   Automatic feeding delivery system+HD digital camera+Japanese Misumi suction rod                                   system+Panasonic CCD optical counterpoint system+HD digital display PC+Panasonic                             servo+Panasonic PLC+an 8-inch digital touchscreen +Grinding level guide rail(Taiwan                               Hiwin)+Dalian Institute of Technology 10-channel temperature control system+ American                           Omega Temperature measurement system+High fever efficiency and heating tube+                                   Resistance to 1800 degree black crystal sand glass

Chip feeding system: Automatic receiving, feeding, automatic induction (optional)

Temperature profile storage: 50000 groups

Optical CCD lens: Automatic stretch out and go back, which can be moved freely before and after by rocker, to eliminate the "observation dead corner" problem

Chip angel adjust: Φ Angle can be 360° rotation, precision fine tuning fitting suction nozzle

PCBA Positioning: Up and down intelligent positioning,bottom "5-point support" with V-groove fixed PCB                                which can be adjusted freely in the X-axis direction, with universal fixtures meanwhile  BGA position: Laser positioning to quickly find the vertical point of the upper and lower temperature zone                         and the central point of BGA

Temperature control: K-type Sensor,Closed loop and 8~20 segments for temperature controlling program

Temperature accuracy: ±1 ℃

Placement Accuracy: +/-0.01mm

CCD system: A CCD HD digital camera, 6 million pixels(Industrial-class), automatic optical zoom, laser positioning Pressure sensor Inductive pressure greater than 0.010-0.030g/c m² will initiate collision pressure protection

Safety guard pressure sensor +emergency knob,double-guard.

Workbench fine-tuning: Back/front±15mm,left/right±15mm

PCB size: Max490*550 mm Min 10×10 mm

PCB thickness: 0.2-15mm

BGA chip: 1x1-65*65mm

Gas source: External gas source

BGA suction mode: Negative pressure vacuum suction, automatic induction release in place

BGA weight: 5-500g (special specification customization)

Minimum chip spacing: 0.15mm

External Temperature Sensor: 5 pcs（optional)

Machine type: Desktop table (optional)

Dimensions: L970*W850*H950 mm

Net weight: 120kg