I.Function ：
1. Automatic picking, automatic feeding, automatic alignment, automatic mounting, automatic
disassembly, automatic welding, and automatic completion of repair;
2. Excellent positioning system, quickly and automatically identifying Mark points, achieving
precise positioning of BGA removal and installation operations;
3. The three temperature zones are independently controlled and can be combined arbitrarily.
The preheating zone can adjust the heating area according to the size of the PCB board;
4. Integrated design of disassembly and tin removal device, easy to handle SMT/THT process
repair;
5. It can be connected to nitrogen for heating protection of PCBA to avoid oxidation and
yellowing, and the flow and negative pressure can be accurately adjusted;
6. Side monitoring system, real-time observation of tin melting status during tin removal
and welding;
7. Equipped with dual overtemperature protection and alarm functions to prevent product damage
due to temperature abnormalities;
8. Separate management and operation permissions to prevent arbitrary modification of
parameter settings by humans;
9. Can interface with MES/SAP system;
10. Suitable for various chip repairs (POP, SOP, SOJ, QFP, QFN, BGA, PLCC, SCP...)
II: Parameters
power: AC380V±10％ 50/60Hz
Total Power: Max 24500W
Top heater: 1500W
Lower heater: 1500W
Bottom heater: 18900W（German heating tube, heating area620×950mm）
Operation mode: Disassembly, welding, suction, and pasting are integrated and
automatically completed! The head and lower temperature zone
can freely move forward, backward, left, and right along the
X and Y axes to meet the different position distribution of
BGA chips on the PCB.
Basic configuration: Automatic material delivery system+high-definition digital
camera+Japanese Mismi suction rod system+Panasonic CCD
optical alignment system+high-definition digital display
PC+upper computer+Panasonic servo+Panasonic PLC+grinding
grade guide rail (Taiwan Shangyin)+Dalian University of
Technology 10 channel temperature control system+American
Omega temperature measurement system+high thermal efficiency
heating brick
Dimensions: L2060×W1760×H2200 mm
Chip feeding system: Automatic feeding, feeding, automatic sensing (optional)
Temperature profile
storage: 50000 groups
Optical CCD lens: Automatic extension and retraction, which can be freely moved
forward, backward, left, and right through program control,
eliminating the problem of "observation dead angles"
IR area: 620×950mm
Chip angel adjust: Φ The angle can be rotated 360 °, and the mounting nozzle
can be precisely adjusted
Positioning: Intelligent positioning up and down, with a "5-point support"
at the bottom and a V-shaped card slot to fix the PCBA. The
PCBA can be adjusted freely in the X direction, and is equipped
with a universal fixture externally
BGA position: Laser positioning to quickly locate the vertical points
between the upper and lower temperature zones and the center
of BGA
Temperature control: K-type thermocouple (K Sensor)+closed loop control (Closed
loop)+8-20 segment temperature control programming
Temp accuracy: ±1degree
Placement Accuracy: +/-0.01mm
CCD system
CCD high-definition digital camera, 20 million pixels,
automatic optical zoom, laser positioning
Pressure sensor: Sensing pressure greater than 10-30G (configurable) will
activate collision and pressure protection
Safety guard Electronic pressure sensing protection: Travel of upper and lower
temperature zones
X-axis 900mm, Y-axis 600mm
PCB size: Max 940×736mm Min 10×10mm
PCB thickness: 0.2-15MM
BGA chip: 2×2-120×120mm
Gas source: External air source+air source filtration system
Gas mold: Inert gases such as air or nitrogen, argon, etc. (non air media
require additional configuration）
BGA absorption mode: Negative pressure vacuum suction, automatic induction release
in place
BGA weight: 50-200g(Special specifications can be customized)
Minimum chip spacing: 0.15mm
External Temperature: Sensor
6（Expandable）
Machine type: floor type
Net weight: About 950kg
