Ⅰ. Function/Features:
1. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;
2. Automatic disassembly, automatic welding, automatic recovery of chips, completely liberating workers;
3. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is
more efficient, and the rework of the large chip is better;
4. Laser positioning, place the motherboard in one step;
5. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant
temperature, environmental protection and energy saving, and beautiful appearance;
6. External temperature measurement interfaces, convenient for temperature detection at any time,
temperature control is more accurate and reliable;
7. Touch screen operation, preset program, which can be used proficiently without professional technical
training, making chip repair very easy;
8. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;
9. An external USB interface is used for software updates and various repair data to be imported into the
computer for analysis and storage;
10. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm.
11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)
Ⅱ. Product parameter
Power Supply AC220V±10％ 50/60Hz
Total Power: 9200W
Top heater: 1200W
Bottom heater" 1200W
IR preheating area: 6400W (Germany heating tube, heating area of 680 *475mm)
Operation mod: Fully automatically disassemble,suction,mounting and soldering
Dimensions: L1080×W1500×H950 mm
Basic configuration: Automatic feeding delivery system+HD digital
camera+Japanese Misumi suction rod system+Panasonic CCD
optical counterpoint system+HD digital display PC +upper computer+Panasonic servo+Panasonic PLC+an 8-inch digital
touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian
Institute of Technology 10-channel temperature control
system+ American Omega Temperature measurement system+High fever efficiency and heating tube+ Resistance to
1800 degree black crystal sand glass
Chip feeding system: Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage: 50000 groups
Optical CCD lens: Automatic stretch out and go back, which can be moved freely
before and after the rocker, to eliminate the "observation dead
corner" problem
IR preheating area: 680×475mm
Chip angel adjust: Φ Angle can be 360° rotation, precision fine tuning fitting
suction nozzle
PCBA Positioning: Up and down intelligent positioning,bottom "5-point support"
with V-groove fixed PCB which can be adjusted freely in the
X-axis direction, with universal fixtures meanwhile BGA position
Laser positioning to quickly find the vertical point of the upper
and lower temperature zone and the central point of BGA
Temperature control
K-type Sensor,Closed loop and 8~20 segments for temperature
controlling program
Temperature accuracy: ±1 ℃
Placement Accuracy: +/-0.01mm
CCD system: A CCD HD digital camera, 2 million pixels, automatic optical
zoom, laser positioning
Pressure sensor Inductive pressure greater than 10-30g (set up) will initiate
collision pressure protection
Safety guard pressure sensor + infrared sensor. Double guard.
Workbench fine-tuning Back/front±15mm,left/right±15mm
PCB size Max 650×550 mm Min 10×10 mm
PCB thickness: 0.2-15mm
BGA chip: 2×2-100×100mm
Gas source: Built-in vacuum pump, no external gas source
BGA suction mode: Negative pressure vacuum suction, automatic induction release
in place
BGA weight: 5-200g (special specification customization)
Minimum chip spacing: 0.15mm
External Temperature Sensor: 5 pcs（optional)
Machine type: Desktop table (optional)
Net weight 150kg
