Ⅰ. Function/Features:
1. Large preheating area which can repair the maximum size of 680*780 mm super large motherboard;
2.The lower temperature area can be moved around 360 degrees, evenly heating the pcb in every corner, to
ensure that the pcb does not deform;
3.Optical counterpoint, chip mount counterpoint precision, completely avoid dislocation offset;
4.Automatic disassembly, welding, recovery of chips, completely liberating workers;
5.The preheating area adopts infrared luminous tube, fast heating, stable constant temperature,
environmental protection and energy saving, beautiful appearance
Touch screen operation, preset program, which can be used proficiently without professional technical
training, making chip repair very easy;
6.Touch screen operation, program built-in advance, without professional technical training can be skillfully
used, so that the chip repair becomes very simple;
7.External USB interface, used for software update and upgrade and import of various repair data into
computer analysis and storage;
8.The operation panel can be pulled out to the operator for easy operation;
9.Suitable for a variety of patch devices to repair (SOP,SOJ, QFP, QFN, BGA, PLCC, SCP.....);
10. Docking MAS system function can be added if need.
Ⅱ. Product parameter
Power Supply: AC380V±10％ 50/60Hz
Total Power: 9500W
Top heater: 1200W
Bottom heater: 800W
IR preheating area: 7200W (Germany heating tube, heating area of 680 *750mm)
Operation mod: Fully automatically disassemble,suction,mounting and
soldering. The preheating area and the tray can move freely
around the X and Y axis to meet the different position distribution of the BGA chip on the PCB
Dimensions: L1680×W1180×H1700 mm
Basic configuration: Automatic feeding delivery system+HD digital
camera+Japanese Misumi suction rod system+Panasonic CCD
optical counterpoint system+HD digital display PC +upper computer+Panasonic servo+Panasonic PLC+a 10-inch digital
touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian
Institute of Technology 10-channel temperature control
system+ American Omega Temperature measurement system+High fever efficiency and heating tube+ Resistance to
1800 degree black crystal sand glass
Chip feeding system: Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage: 50000 groups
Optical CCD lens: Automatic stretch out and go back, which can be moved freely
before and after the rocker, to eliminate the "observation dead
corner" problem
IR preheating area: ≥600×750mm
Chip angel adjust: Φ Angle can be 360° rotation, precision fine tuning fitting
suction nozzle
PCBA
Positioning: Up and down intelligent positioning,bottom "5-point support"
with V-groove fixed PCB which can be adjusted freely in the
X-axis direction, with universal fixtures meanwhile
BGA position: Laser positioning to quickly find the vertical point of the upper
and lower temperature zone and the central point of BGA
Temperature control: K-type Sensor,Closed loop and 8~20 segments for temperature
controlling program
Temperature accuracy: ±1 ℃
Placement Accuracy: +/-0.01mm
CCD system: A CCD HD digital camera, 2 million pixels, automatic optical
zoom, laser positioning
Pressure sensor: Inductive pressure greater than 10-30G (set up) will initiate
collision pressure protection
Safety guard pressure sensor + infrared sensor. Double guard.
Workbench fine-tuning: Back/front±15mm,left/right±15mm
PCB size: Max 680×780 mm Min 10×10 mm
PCB thickness: 0.2-15mm
BGA chip: 2×2-90*90mm
Gas source: External gas source + gas source filtration system
Gas media: air or nitrogen or argon (non-air media is required to add more
configuration)
BGA suction mode: Negative pressure vacuum suction, automatic induction release
in place
BGA weight: 5-200g (special specification customization)
Minimum chip spacing: 0.15mm
External Temperature Sensor: 5 pcs（optional)
Machine type: floor type
Net weight Appro: 820kg
